Method of making constant clearance flat link fine wire interconnections

A method of directing an automatic wire bonder to make a fine wire interconnection between the first and the second bonding pad on a semiconductor device to be bonded and for simultaneously pre-forming said fine wire, comprising the steps of:

• teaching the automatic wire bonder the X,Y and Z locations of the desired first and second bonding points at the first and second bonding pads of the semiconductor device to be bonded and the length of link L1,
• generating in said memory lines and space representative of the edges of said semiconductor device as viewed from a top or plane view,
• generating in the memory of said automatic wire bonder hypothetical device edge lines in space between the first and second bonding points which are parallel to and removed from the edge of said semiconductor device at a point where it is desired that links L2 and L3 form a kink angle point,
• generating in the memory of the automatic wire bonder a desired three link geometric profile of each of the wire interconnections to be made,
• generating and storing in said memory the lengths of links L1, L2 and L3 and an angle theta 3 representative of the value between the axes of the links L2 and L3 in space as viewed in side elevation,
• said step of generating and storing in said memory the link L2 comprising the steps of calculating the X,Y distance from said first bonding point to the X,Y kink point in space where the axes of link L2 intersects at hypothetical device edge line between said first and second bonding points,
• said steps of generating and storing in said memory the link L3 comprising the steps of calculating the X,Y and Z distance from said second bonding point to said X,Y point in space where the axes of link L2 intersects the hypothetical device edge line,
• calculating a first point K1 and a second point K2 in space for forming the kinks in links L1 to L3,
• making a first wire bond on a first pad of a semiconductor device to be bonded,
• directing the automatic wire bonder to move its bonding tool along a predetermined path from a first pad to a second pad of the semiconductor device to be bonded,
• simultaneously pre-forming said links L1, L2 and L3 at kink points K1 and K2 in space, and
• making a second wire bond on the second pad of said semiconductor device to be bonded so that the links L1, L2 and L3 form said three link geometric profile.