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US 5,205,032 AGranted
Electronic parts mounting apparatus
AssigneeKabushiki Kaisha Toshiba
InventorsFumihiko Kuroda, Hideto Furuyama, Mayumi Sakaguchi, Hiroshi Hamasaki, Masaru Nakamura
Life of this patent
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Abstract
An electronic parts mounting device according to this invention is characterized by including a mount body which is obtained by bonding at least two substrates each having a predetermined thicknesses and a smooth surface and which has at least one bonding portion, the mount body having at least one recessed portion selectively formed in one exposed surface of the mount body to reach the bonding portion, and the recessed portion having a tapered shape widened from the bonding portion to the exposed surface, and an electronic part mounted in the recessed portion.
Claims18
An electronic parts mount device comprising:
- a mount body which is obtained by bonding at least two substrates each having a predetermined thickness and a smooth surface, wherein one of said substrates has at least one bonding portion, said mount body having at least one recessed portion selectively formed in one exposed surface of said mount body to a depth which reaches said bonding portion;
- and
- an electronic part mounted in said recessed portion.
An electronic parts mounting device comprising:
- a mount body (150) constituted by at least three substrates having predetermined thicknesses and bonded by stacking;
- said mount body having first and second bonding portions, first and second exposed surfaces, and at least one recessed portion selectively formed to extend from said first exposed surface and reach said second bonding portion through said first bonding portion, and the width of said first recessed portion being wider than the width of said second recessed portion;
- and
- an electronic part mounted in said recessed portion.
1 more element
An apparatus for mounting electronic parts comprising:
- a substrate having a recessed portion for mounting an electronic part therein, the electronic part being machined to have a predetermined shape;
- holding means for holding said substrate;
- moving means for holding the electronic part and moving the electronic part to said recessed portion of said substrate;
- and
- vibration generating means for applying a small vibration to at least one of said substrate and the electronic part.
2 more elements
An electronic parts mount device comprising:
- a mount body which is obtained by bonding together at least first and second substrates through an intermediate bonding layer, each of said substrates having a predetermined thickness and at least one smooth surface, wherein the first substrate has at least one bonding portion located on a surface thereof which is in contact with said intermediate bonding layer, the mount body having at least one recessed portion selectively formed in an exposed surface of said second substrate and said bonding layer to a depth which reaches said bonding portion of said first substrate;
- and
- an electronic part mounted in said recessed portion.
An electronic parts mounts device comprising:
- a mount body which is obtained by bonding at least two substrates each having a predetermined thickness and a smooth surface, wherein one of said substrates has at least one bonding portion, said mount body having at least one recessed portion selectively formed in one exposed surface of said mount body to a depth which reaches said bonding portion;
- an electronic part being machined to have a predetermined shape;
- holding means for holding said mount body;
- moving means for holding said electronic part and moving said electronic part to said recessed portion;
- and
- vibration generating means for applying a small vibration to at least one of said mount body and said electronic part.
3 more elements
An electronic parts mount device comprising:
- a mount body which is obtained by bonding at least first and second substrates through an intermediate bonding layer, each of said substrates having a predetermined thickness and at least one smooth surface, wherein the first substrate has at least one bonding portion located on a surface thereof which is in contact with said intermediate bonding layer, said mount body having at least one recessed portion selectively formed in an exposed surface of said second substrate and said bonding layer to a depth which reaches said bonding portion of said first substrate;
- an electronic part being machined to have a predetermined shape;
- holding means for holding said mount body;
- moving means for holding said electronic part and moving said electronic part to said recessed portion;
- and
- vibration generating means for applying a small vibration to at least one of said mount body and seaid electronic part.
3 more elements
An electronic parts mount device comprising:
- a mount body which is obtained by bonding together at least first and second substrates through an intermediate bonding layer, each of said substrates having a predetermined thickness and at least one smooth surface, wherein the intermediate bonding layer has at least one bonding portion located on a surface thereof which is in contact with said second substrate, the mount body having at least one recessed portion selectively formed in an exposed surface of said second substrate to a depth which reaches said bonding portion of said intermediate bonding layer;
- and
- an electronic part mounted in said recessed portion.
Dependencies are inferred from the claim text.