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US 5,204,925 AGranted
Optical interconnection of circuit packs
AssigneeAT&T Bell Laboratories
InventorsRocco Bonanni, William J. Parzygnat, Roger E. Weiss
Life of this patent
Estimating the term…
Abstract
Disclosed is an apparatus for the optical interconnection of circuit packs and components mounted on circuit packs, and a method of manufacture. Optical fibers are bonded to a flexible substrate. The substrate includes tabs that can be terminated by standard V-groove silicon chip connectors for optical connection to the edges of circuit packs.
Claims19
Optical interconnection apparatus comprising:
- a flexible substrate including a main body portion and a plurality of tab portions extending therefrom, said tab portions being capable of twisting at an angle with respect to the body portion;
- a plurality of optical fibers mounted to the substrate so that their ends extend beyond the edges of the tabs and the ends of a plurality of fibers extend to different tabs;
- and
- optical fiber termination means at the edges of the tabs to permit connection to the optical fibers.
1 more element
A method of fabricating an optical interconnection apparatus comprising the steps of:
- providing a flexible substrate including a main body portion and a plurality of tab portions extending therefrom said tab portions being capable of twisting at an angle with respect to the body portion;
- mounting to the substrate a plurality of optical fibers, each including two ends which extend beyond the edges of different tabs such that the ends of said plurality of fibers extend to different tabs;
- forming a cover layer over the fibers;
- and
- providing termination means at the edges of the tabs to permit connection to the optical fibers.
2 more elements
Dependencies are inferred from the claim text.