Module attachment for printed circuit board test fixtures

A module attachment for a test fixture having a bed of nails array of spring contact electrical test probes for testing a printed circuit board comprising:

• a) spaced spring contact electrical test probes extending from said test fixture;
• b) a module having first and second sides with said first side having means for mounting said module upon said spaced test probes and supporting said module about a test fixture surface;
• c) an array of wires extending outwardly from said module second side, said array being formed to correspond with a selected test site array;
• d) said wires having conductor leads extending from said second side of said module for connection to a wiring harness of said test fixture.

A module attachment for a test fixture having a bed of nails array of spring contact probes comprising:

• a) spaced spring contact test probes extending from said fixture;
• b) a module having first and second sides with said first side having means for mounting said module above a test fixture surface, said means for mounting providing alignment adjustment;
• c) an array of wires extending outwardly from Said module second side, said array being formed to correspond with a selected test site array;
• d) said wires having conductor leads extending from said second side of module for connection to a wiring harness of said test fixture.

A module attachment for a test fixture having a bed of nails array of spring contact test probes for testing a printed circuit board comprising:

• a) spaced spring contact probes extending from said test fixture;
• b) a module having first and second sides with said first side having means for mounting said module upon said spaced spring contact probes and supporting said module above a test fixture surface;
• c) said module having an edge bar portion extending there along having a plurality of spaced grooves at preselected intervals to accord with a preselected pitch of printed circuit board test pads, said edge bar being a comb structure;
• d) an array of wires extending outwardly from said module second side and respectively through said spaced grooves for spacing said wires at said preselected intervals, said array being formed to correspond with a selected test pad array;
• e) said wires having conductor leads extending from said second side of said module for connection to a wiring harness of said test fixture.

A module attachment for a test fixture having an array of probes for supporting and testing a printed circuit board, said module attachment comprising:

• a) a module having first and second sides with said first side having means for mounting said module upon said probes and supporting said module above a test fixture surface;
• b) an array of contact means extending outwardly from said module second side, said array of contact means being of preselected configuration to conform with a selected configuration of test pad sites of said printed circuit board;
• said contact means having engagement portions for electrical connection to said test pad sites for testing said printed circuit board;
• c) conductor leads affixed to and extending from said module and electrically connected to said contact means, said conductor leads being for connection to a test fixture circuit for testing a printed circuit board.

A module attachment for a test fixture for printed circuit boards comprising:

• a) spaced mounting posts extending from a test fixture;
• b) a module having a transverse periphery having first and second locations with said first location having means for mounting said module upon said spaced mounting posts and supporting said module above a test fixture surface;
• c) an array of wires extending outwardly from said module second location, said array of wires being formed to correspond with a selected test site array;
• and
• d) said array of wires having respective conductor leads extending from said second location of said module for connection to a wiring harness of said test fixture.