Photosensitive resin composition
AssigneeToyo Boseki Kabushiki Kaisha
InventorsYuji Taguchi, Toshiaki Fujimura
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Abstract
A photosensitive resin composition which is excellent in flexibility and impact resilience, which is less affected by humidity is provided. This composition comprises a soluble synthetic polymer, a photo-polymerizable unsaturated compound, and a photo-polymerization initiator, wherein the soluble synthetic polymer comprises an addition polymer obtained by the reaction between a diamine compound having amino groups selected from primary and secondary amino groups and having no amide bonds in its molecule and a diisocyanate compound; and the addition polymer contains a polyoxyalkylene glycol component in an amount of 20 to 80% by weight.
Claims3
A photosensitive resin composition comprising a soluble synthetic polymer, a photopolymerizable unsaturated compound, and a photopolymerization initiator;
- wherein said soluble synthetic polymer comprises an addition polymer obtained by the reaction between diamine compounds having amino groups selected from primary and secondary amino groups and having no amide bonds in their molecules and a diisocyanate compound;
- wherein said addition polymer contains a polyoxyalkylene glycol component and said diamine compounds are a combination of at least one hydrophilic diamine and at least one hydrophobic diamine.
Dependencies are inferred from the claim text.