US 5,203,659 AGranted

Die presentation system for die bonder

AssigneeEmhart Inc.

InventorsKarl Schweitzer, Gerhard Zeindl

Life of this patent

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Abstract

A die presentation package exchange system for use in a hybrid die bonder, in particular an automatic hybrid die bonder, which system comprises a magazine (10) for storing a plurality of die presentation packages (12). The system further comprises a clamp assembly (40), adapted to collect a selected die presentation package (12) from the magazine (10) and feed it to a die eject station (204) of the die bonding machine. The clamp assembly (40) is further adapted to retrieve the die presentation package (12) from the die eject station (204) after a predetermined number of dice have been ejected, and return it to the magazine (10). The magazine (10) further comprises indexing structure for indexing movement of the packages (12) within the magazine (10) so that the selected package is located at a collection point for collection from the magazine (10). The system further comprises indexing structure for indexing rotation of the clamp assembly (40) about its axis (62). The die presentation package exchange system makes it possible to change from one die presentation package to another with minimum delay, and consequently minimum loss in production time.

Claims3

Dependent claims

A die presentation system comprising

a plurality of die presentation packages,
a magazine including means for horizontally supporting said packages vertically one above the other,
means for guiding said magazine for vertical displacement to locate any one of said supported packages at a pick up/deposit location,
means for picking up/depositing a package at said pick up/deposit location including
means for horizontally mounting one of said packages,
said mounting means being rotatable about a vertical axis,
means for rotatably displacing said mounting means to said pick up/deposit location,
said mounting means including a clamping element movable vertically from a remote position where said mounting means can be horizontally, rotatably displaced to said pick up/deposit location to pick up a package supported at said pick up/deposit location, to an operative position for clamping a package, and
said supporting means including a clamping element for each of said supported packages movable vertically from a remote position where said mounting means can rotatably, horizontally displace a clamped package to said pick up/deposit location, to an operative position for clamping a package located at said pick up/deposit location.

6 more elements

Dependencies are inferred from the claim text.

Facts

Application: 07/896,495Filed 2 Jun 1992 · continuation
Priority: GB 900603616 Mar 1990
Granted: 20 Apr 1993
Term ends: Not estimatedThe source records don’t support an estimate.

Classification6 codes

H10P 72/0446
Apparatus for manufacture or treatment: apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
H10P 72/7602
Using mechanical means, e.g. clamps or pinches: the wafers being placed on a robot blade or gripped by a gripper for conveyance
H10P 72/7622
The wafers being placed on a susceptor, stage or support: characterised by supporting substrates others than wafers, e.g. chips
Y10S 414/141
Associated with semiconductor wafer handling: includes means for gripping wafer