US 5,203,078 AGranted

Printed wiring board for IC cards

AssigneeIbiden Co., Ltd.

InventorsChiaki Nakanishi, Atsushi Hiroi, Yoji Yanagawa

Life of this patent

Estimating the term…

Loading patent…

Abstract

This invention relates to a printed wiring board (10) for IC cards to be built in or fitted to a contact type IC card, that is, an IC card having external contact terminals. The present invention is to provide a printed wiring board (10) for IC cards wherein bumps (20) are formed in a part of a conductor circuit (13) of this printed wiring board (10) for IC cards and are made external contact terminals, futhermore wherein only the contact surfaces of the external contact terminals are exposed on the surface of the IC card (30) and the surfaces of the external contact terminals and the surface of an over sheet (14) are made to be on the same plane level, so that, in case the IC card (30) is bent, an IC module (12) may be perfectly prevented from springing out and further the electric contact reliability of the external contact terminal may be also high.

Claims9

Dependent claims

A method for producing a printed wiring board for an IC card, wherein said printed wiring board has a substrate of a non-conductive material, a printed wiring pattern on said substrate, and bumps on said printed wiring pattern, comprising:

forming a plating mask on said printed wiring pattern and said substrate, said plating mask having windows, each window corresponding to the size and location of each said bump which is to be plated to a predetermined part of said printed wiring pattern;
plating an electroconductive material to said printed wiring pattern exposed by each said window of said plating mask to form platings having a top surface;
with the plating mash in place over said printed wiring pattern and said substrate, surface treating only the top surface of the platings in order to form said bumps;
removing said plating mask to expose said bumps;
and
surrounding said bumps and covering said printed wiring pattern and said substrate with an over sheet of a non-conductive material.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application: 07/707,627Filed 30 May 1991 · division
Priority: JP 60-15919217 Jul 1985
Granted: 20 Apr 1993
Term ends: Not estimatedThe source records don’t support an estimate.

Classification21 codes

G06K 19/077
With integrated circuit chips: constructional details, e.g. mounting of circuits in the carrier
B42D 25/00
Information-bearing cards or sheet-like structures characterised by identification or security features
B42D 25/30
Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof: identification or…
G06K 19/07743
Constructional details, e.g. mounting of circuits in the carrier: external electrical contacts