Method of forming three-dimensional features on substrates with adjacent insulating films

A method of producing a three-dimensional feature on a substrate and adjacent electrically insulating films comprising:

• depositing an opaque film on a transparent substrate;
• forming a plurality of spaced apart resist portions on the opaque film;
• etching the opaque film to remove portions of the opaque film not covered by the resist portions, exposing part of the substrate and undercutting the resist portions so that the resist portions include overhanging portions spaced from the transparent substrate without any of the opaque film therebetween;
• depositing, in a chemical vapor deposition process at a relatively low temperature, a discontinuous transparent electrically insulating film to a thickness producing a desired phase shift in incident light and no greater in thickness than the thickness of the opaque film in first segments on the respective resist portions and in second segments, discontinuous from the first segments, on the exposed part of the substrate between remaining portions of the opaque film, including on the exposed part of the substrate between the exposed portion of the substrate and the overhanging portions of the resist portions;
• and
• lifting off the resist portions and the first segments of the insulating film disposed on the resist portions.

The method of producing three-dimensional interconnected wiring on a substrate comprising:

• depositing a first metal film and a second metal film on a substrate;
• producing a resist on a portion of the second metal film;
• etching the second metal film using the resist as a mask, leaving a portion of the second metal film on the first metal film between the first metal film and the resist;
• depositing, in an electron cyclotron resonance chemical vapor deposition process at a temperature below 150.degree. C., a discontinuous electrically insulating film to a thickness approximately equal to and no greater than the thickness of the second metal film in a first segment on the resist and in a second segment, discontinuous from the first segment, on the first metal film;
• lifting off the resist and the first segment of the insulating film disposed on the resist;
• and
• depositing a third metal film on the second segment of the insulating film and on the remaining portion of the second metal film, thereby electrically connecting the third metal film to the first metal film.