US 5,198,963 AGranted

Multiple integrated circuit module which simplifies handling and testing

AssigneeMotorola, Inc.

InventorsDebabrata Gupta, James E. Drye

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Abstract

A multi-chip module (26) used to interconnect and house a plurality of integrated circuits (10). The module (26) employs an intermediate structure referred to, herein, as a bridge chip (12). The bridge chip (12) connects the integrated circuit (10) to the module substrate (19). The integrated circuit (10) is attached to the bridge chip (12) and forms a composite structure (18) which can be burned-in and tested as an individual unit. The bridge chip (12) has interconnects to bring out the inputs and outputs of the integrated circuit (10). The composite structure (18) is mounted to the module substrate (19) such that, the integrated circuit (10) has a thermal pathway to the module substrate (19), and the bridge chip (12) connects to the module substrate (19). The module substrate (19) has interconnects to connect the plurality of composite structures (18).

Claims15

Dependent claims

A multiple integrated circuit module which simplifies handling and testing comprising:

a plurality of integrated circuits, each integrated circuit having specific contact points;
a plurality of bridge chips, each bridge chip having a corresponding integrated circuit from the plurality of integrated circuits wherein each bridge chip has a plurality of contact points, some of which correspond to the specific contact points of the corresponding integrated circuit;
a first means for interconnecting predetermined ones of the contact points on each bridge chip;
a second means for interconnecting the specific contact points of a corresponding integrated circuit to the contact points corresponding to specific contact points of the bridge chip comprising a plurality of solder bumps of a first thermal melting temperature;
a module substrate for receiving each combination of an integrated circuit interconnected to a corresponding bridge chip, the module substrate having a plurality of contact points corresponding to remaining contact points on each bridge chip;
a third means for interconnecting the contact points on the module substrate;
and
a fourth means for interconnecting the contact points of the module substrate to remaining contact points on each bridge chip comprising solder bumps of a second thermal melting temperature.

5 more elements

A multiple integrated circuit module comprising:

a module substrate wherein the module substrate has a plurality of contact points for coupling externally;
a plurality of integrated circuits each integrated circuit has a plurality of specific contact points for coupling externally;
a plurality of bridge chips, each bridge chip having a plurality of contact points some of which correspond to the specific contact points of a corresponding integrated circuit;
a first means for interconnecting each of the plurality of integrated circuits to a corresponding bridge chip of the plurality of bridge chips wherein the first means for interconnecting comprises a plurality of solder bumps, wherein each solder bump connects a specific contact point of an integrated circuit to a corresponding contact pad of a corresponding bridge chip, and wherein the plurality of solder bumps has a just thermal melting temperature;
and
a second means for interconnecting remaining contact points on each of the plurality of bridge chips to corresponding contact points on the module substrate wherein the second means for interconnecting comprises a plurality of solder bumps, wherein each solder bump connects a remaining contact point on a bridge chip to a corresponding contact pad on the module substrate, and wherein the plurality of solder bumps has a lower thermal melting temperature than the first means for interconnecting.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application: 07/795,440Filed 21 Nov 1991
Granted: 30 Mar 1993
Term ends: Not estimatedThe source records don’t support an estimate.

Classification12 codes

G01R 31/2863
External aspects, e.g. related to chambers, contacting devices or handlers: contacting devices, e.g. sockets, burn-in boards or mounting fixtures
G01R 31/2886
Testing of integrated circuits [IC]: features relating to contacting the IC under test, e.g. probe heads; chucks
H10P 74/23
Testing or measuring during manufacture or treatment of wafers, substrates or devices: characterised by multiple measurements, corrections,…
H10W 70/611
Insulating or insulated package substrates; Interposers; Redistribution layers: for connecting multiple chips together