Semiconductor integrated circuit device with optical transmit-receive means

A semiconductor integrated circuit device comprising:

• at least two semiconductor packaging substrates superposed on one another, each of said semiconductor packaging substrates having at least one opening at a position corresponding to that of another semiconductor packaging substrate;
• a plurality of semiconductor integrated circuits selectively mounted on a portion of the exposed surface of each of said semiconductor packaging substrates which excludes said opening;
• a lens provided in each opening;
• light transmit-receive elements each having at least one light emitting element and at least one light receiving element which are formed integral with each other and covering ends of each opening;
• and
• wires for electrically connecting said semiconductor integrated circuits on each of said semiconductor packaging substrates with each other and connecting said semiconductor integrated circuits on each thereof to said light transmit-receive means,
• wherein said semiconductor integrated circuits perform predetermined batch-process of electric signals, respectively.

A semiconductor integrated circuit device comprising:

• a plurality of semiconductor packaging substrates arranged parallel to one another;
• a plurality of semiconductor integrated circuits mounted one each of said semiconductor packaging substrates;
• connecting means for electrically connecting said semiconductor integrated circuits on each of said semiconductor packaging substrates with each other;
• optical signal transmitting means, electrically connected to at least one of said semiconductor integrated circuits on each of said semiconductor packaging substrates, for converting electric signals input by said semiconductor integrated circuits on one semiconductor packaging substrate to an optical signal and outputting the optical signal to another semiconductor packaging substrate;
• and
• optical signal receiving means, electrically connected to at least one of said semiconductor integrated circuits on each of said semiconductor integrated circuit substrates, for receiving an optical signal output from one semiconductor packaging substrate, converting the optical signal to electric signals, and outputting the electric signals to said semiconductor integrated circuits,
• wherein said semiconductor integrated circuits batch-process electric signals and said optical signal transmitting means and said optical signal receiving means are formed integral with each other.