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US 5,198,479 AGranted
Light transmissive epoxy resin compositions and optical semiconductor devices encapsulated therewith
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsToshio Shiobara, Koji Futatsumori, Kazuhiro Arai
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Abstract
In a light transmissive epoxy resin composition comprising (A) an epoxy resin and (B) a curing agent are blended (C) an organic phosphorus anti-discoloring agent and (D) silica-titania glass beads surface treated with an organic silicon compound. The composition restrains coloring in composition form and discoloration in cured form while curing into clear low stressed products having high light transmittance. Optical semiconductor devices encapsulated with the cured epoxy resin composition are reliable.
Claims9
A light transmissive epoxy resin composition comprising
- (A) a compound having at least two epoxy groups in a molecule,
- (B) an acid anhydride curing agent,
- (C) an organic phosphorus anti-discoloring agent, and
- (D) silica-titania glass beads surface treated with an organic silicon compound.
1 more element
Dependencies are inferred from the claim text.