Solder reflow oven

A solder reflow oven useful for annealing electronic parts through convective heating, comprising:

• a. an enclosed chamber having an entrance and an exit, the chamber having an upper part and a lower part and enclosing a multiplicity of heating zones, including a preheat zone located proximal to the entrance, a cool-down zone located proximal to the exit and a reflow zone located between the preheat zone and the cool-down zone in the lower part of the enclosed chamber;
• b. a conveyor located for transporting electronic parts from said entrance to said exit in said lower part of said chamber;
• c. a diffuser plate suspended in said upper part of said chamber and having a central duct and a periphery edge;
• d. an entrance heater plate and an exit heater plate mounted on said periphery edge of said diffuser plate and located proximal to said preheat and cool-down zones respectively;
• e. an impeller rotatably mounted above said central duct of said diffuser plate for forcing air to circulate around said diffuser plate, the rotation of the impeller forming in said chamber essentially a circulatory entrance main airstream and a circulatory exit main airstream;
• f. said entrance main airstream being originated from said impeller and circulating from above said diffuser plate at a high speed, around said entrance heater plate, then between said diffuser plate and said conveyor and toward said central duct of said diffuser plate;
• g. said exit main airstream also being originated from said impeller and circulating from above said diffuser plate, around said exit heater plate, then between said diffuser plate and said conveyor and toward said central duct of said diffuser plate;
• and
• h. said entrance and exit main airstreams finally forming a central airflow at a lower central region between said diffuser plate and said conveyor and below said central duct of the diffuser plate, the central airflow flowing upwardly through said central duct of said diffuser plate and toward said impeller to complete air circulation within said chamber;
• i. whereby said solder reflow oven can anneal electronic parts through convective heating, where graduated temperature zones are established by causing air circulation in the manner described above, without having excessive airflow over the electronic parts being annealed.

A solder reflow oven useful for annealing electronic parts through convective heating, comprising:

• a. an enclosed chamber defined by a top wall, a bottom wall, a front wall with an entrance, a rear wall with an exit and two side walls, the chamber having an upper part and a lower part and enclosing three zones, including a preheat zone located proximal to the entrance, a cool-down zone located proximal to the exit and a reflow zone located between the preheat zone and the cool-down zone in the lower part of the enclosed chamber;
• b. a conveyor located adjacent to said bottom wall of said chamber for transporting electronic parts from said entrance to said exit in said lower part of said chamber;
• c. a generally rectangular shaped diffuser plate suspended horizontally in said upper part of said chamber, the diffuser plate having an upper surface and a lower surface, a front edge and an opposite rear edge and two lateral edges, and the diffuser plate further having a central duct;
• d. an entrance heater plate mounted on said front edge of said diffuser plate proximal to said preheat zone, maintaining a front gap to said front wall of said chamber;
• e. an exit heater plate mounted on said rear edge of the diffuser plate proximal to said cool-down zone, maintaining a rear gap to said rear wall of said chamber;
• f. two lateral heater plates mounted respectively on said two lateral edges, maintaining respective lateral gaps to said two side walls of said chamber;
• g. a multiplicity of heater fins mounted on each respective heater plate and oriented perpendicular to that respective heater plate, the heater fins being spaced apart in parallel and positioned vertically above each heater plate for allowing air flowing through with low resistance in generally straight streams in a general direction perpendicular to that respective heater plate;
• h. an impeller rotatably mounted between said top wall of said chamber and said upper surface of said diffuser plate and above said central duct of said diffuser plate for forcing air to circulate around said diffuser plate, the rotation of the impeller forming in said chamber essentially a circulatory entrance main airstream and a circulatory exit main airstream, and two circulatory secondary airstreams;
• i. said entrance main airstream being originated from said impeller and including a high velocity entrance airflow circulating above said diffuser plate between said top wall of said chamber and said upper surface of said diffuser plate and toward said front gap, an entrance passage airflow circulating around said entrance heater plate through said front gap, and a low velocity entrance airflow circulating below said diffuser plate between said lower surface of said diffuser plate and said conveyor and toward said central duct of said diffuser plate;
• j. said exit main airstream also being originated from said impeller and including a high velocity exit airflow circulating above said diffuser plate between said top wall of said chamber and said upper surface of said diffuser plate and toward said rear gap, an exit passage airflow circulating around said exit heater plate through said rear gap, and a low velocity exit airflow circulating below said diffuser plate between said lower surface of said diffuser plate and said conveyor and toward said central duct of said diffuser plate;
• k. said two secondary airstreams again being originated from said impeller and circulating from above said diffuser plate between said top wall of said chamber and said upper surface of said diffuser plate, around said two lateral heater plates respectively through said lateral gaps, and below said diffuser plate between said lower surface of said diffuser plate and said conveyor and toward said central duct of said diffuser plate;
• l. said entrance and exit main airstreams and said two secondary airstreams finally forming a central airflow at a lower central region between said lower surface of said diffuser plate and said conveyor and below said central duct of the diffuser plate, the central airflow flowing upwardly through said central duct of said diffuser plate and toward said impeller to complete air circulation within said chamber;
• m. an entrance air fin mounted on said front wall and located above said entrance of said chamber for guiding a substantially large portion of said entrance main airstream toward said lower central region;
• n. an exit air fin mounted on said rear wall and located above said exit of said chamber for guiding a substantially large portion of said exit main airstream toward said lower central region;
• o. an entrance exhaust vent located proximal to said entrance of said chamber for exhausting an entrance vent airstream, which is a small portion of said entrance main airstream, to expel noxious gases from said chamber;
• and
• p. an exit exhaust vent located proximal to said exit of said chamber for exhausting an exit vent airstream, which is a small portion of said exit main airstream, to expel noxious gases from said chamber;
• q. whereby said solder reflow oven can anneal electronic parts through convective heating, where graduated temperature zones are established by causing air circulation in the manner described above, without having excessive airflow over the electronic parts being annealed.