Pin attachment tool and method of capacitive brazing
AssigneeAluminum Company of America
InventorsRobert A. Cargnel, James R. Morran
Life of this patent
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AssigneeAluminum Company of America
InventorsRobert A. Cargnel, James R. Morran
Estimating the term…
A method is provided to replace a damaged pin in a module for an integrated circuit assembly without damaging the circuit device or chip mounted in a circuitized substrate. This method comprises brazing a new pin to the base of the old pin by capacitive discharge brazing with a ribbon of compatible metal foil, requiring no flux, and is effected by firing the charge by completing a circuit which includes a pin attachment tool, the ribbon and the power supply, but in which circuit the chip is bypassed. The arc is struck and the new pin is brazed to the old without generating sufficient heat to damage the chip, and without conducting any current through the chip. The attachment tool is uniquely adapted to clamp the new pin and locate the pin precisely over the base of the old pin.
A method for replacing a damaged pin, separated near its base from the substrate in a module for an integrated circuit assembly including at least one circuit device mounted on a circuitized substrate, with a new pin, said method comprising,
An attachment tool for attaching a new pin to a base of an old pin removed from a circuitized substrate in a module for an integrated circuit assembly including at least one circuit device mounted on said substrate, comprising,
A repaired module for an integrated circuit assembly including at least one circuit device mounted on a circuitized substrate, said module having at least one pin which is a replacement or new pin which has been attached to the substrate by capacitive brazing said new pin to the base of a damaged pin separated near its base from said substrate, said new pin being identifiable by a bond fixedly securing said new pin to said base, said bond being visible by microscopic examination of said base.
A system for replacing a damaged pin, separated near its base from the substrate in a module for an integrated circuit assembly including at least one circuit device mounted on a circuitized substrate, with a new pin, said system comprising,
Dependencies are inferred from the claim text.