Back to results
US 5,190,637 AGranted
Formation of microstructures by multiple level deep X-ray lithography with sacrificial metal layers
AssigneeWisconsin Alumni Research Foundation
InventorHenry Guckel
Life of this patent
Estimating the term…
Abstract
The abstract isn’t available for this document.
Claims21
A method of forming micromechanical structures comprising the steps of:
- (a) providing a plating base on a surface of a substrate;
- (b) applying a photoresist in a layer onto the plating base;
- (c) exposing the photoresist in a pattern to radiation to render the photoresist dissolvable in a pattern;
- (d) removing the dissolvable photoresist;
- (e) electroplating a first layer of a primary metal onto the plating base in the area from which the photoresist has been removed;
- (f) removing the remainder of the photoresist;
- (g) electroplating a first layer of a secondary metal onto the plating base to cover and surround the first layer of the primary metal, the secondary metal chosen so that it can be differentially etched without substantially etching the primary metal;
- (h) machining the exposed surface of the secondary metal down to a flat surface to a selected height which exposes the first layer of the primary metal.
5 more elements
A method of forming micromechanical structures comprising the steps of:
- (a) providing a plating base on a surface of a substrate;
- (b) applying a photoresist in a layer onto the plating base;
- (c) exposing the photoresist in a pattern to radiation to render the photoresist dissolvable in a pattern;
- (d) removing the dissolvable photoresist;
- (e) electroplating a first layer of a primary metal onto the plating base in the area from which the photoresist has been removed;
- (f) removing the remainder of the photoresist;
- (g) electroplating a first layer of a secondary metal onto the plating base to cover and surround the first layer of the primary metal, the secondary metal chosen so that it can be differentially etched without substantially etching the primary metal;
- (h) machining the exposed surface of the secondary metal down to a flat surface to a selected height which exposes the first layer of the primary metal;
- (i) applying a photoresist in a layer over the exposed first layer of primary metal and the first layer of secondary metal;
- (j) exposing the photoresist to radiation in a pattern to render the photoresist dissolvable in a pattern;
- (k) removing the dissolvable photoresist;
- (l) electroplating a second layer of a primary metal in the area from which the photoresist has been removed to cover at least part of the exposed surface of the first layer of primary metal and to also cover part of the exposed surface of the first layer of secondary metal;
- (m) removing the remainder of the photoresist;
- (n) electroplating a second layer of a secondary metal over the second layer of the primary metal and over the surface of the first layer of the primary and secondary metals;
- and surface to a height which exposes the second layer of the primary metal.
12 more elements
Dependencies are inferred from the claim text.