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US 5,188,990 AGranted
Low temperature sealing glass compositions
AssigneeVLSI Packaging Materials, Inc.
InventorsMaurice E. Dumesnil, Leo Finkelstein
Life of this patent
Estimating the term…
Abstract
Low temperature sealing glass compositions comprising 35 to 80% by weight TeO.sub.2, 15 to 50% V.sub.2 O.sub.5 and 0.1 to 20% Nb.sub.2 O.sub.5, ZrO.sub.2 and/or ZnO.
Claims16
A low melting glass composition consisting essentially of:
- (a) TeO.sub.2 :
- 35 to 80%
- (b) V.sub.2 O.sub.5 :
- 15 to 50%, and
- oxides selected from the group consisting of
- (i) Nb.sub.2 O.sub.5, ZrO.sub.2, and ZnO 0.1 to 20%,
- (ii) Bi.sub.2 O.sub.3 and CuO 0.1 to 30%, and
- (iii) P.sub.2 O.sub.5 and Ta.sub.2 O.sub.5 0.1 to 10%, and
- up to 10% (weight calculated on an oxide basis) of SnO.sub.2, CdO, BaO, WO.sub.3, MoO.sub.3, TiO.sub.2, or a metal fluoride, said composition being substantially free of Ag.sub.2 O.
6 more elements
A low melting glass composition consisting essentially of in weight percent calculated on a oxide basis:
- (a) TeO.sub.2 :
- 50 to 60%
- (b) V.sub.2 O.sub.5 :
- 30 to 50%
- (c) Nb.sub.2 O.sub.5, ZnO and/or ZrO.sub.2 :
- 1 to 10%.
3 more elements
Dependencies are inferred from the claim text.