US 5,184,285 AGranted

Socket constructed with molded-in lead frame providing means for installing additional component such as a chip capacitor

AssigneeAdvanced Interconnections Corporation

InventorsJames V. Murphy, Michael J. Murphy

Life of this patent

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Abstract

A socket for connecting a first component to a circuit board. The socket includes pins for connection between the component and the board and a pair of lead frame regions, which are each electrically connected to at least one pin. Each of these regions includes a connection region for making connections to a second component. Insulative plastic is molded around the regions and defines holes through which the pins are inserted. A receptor opening is provided for receiving the second component. The first component may be an integrated circuit, the second a chip capacitor, and the socket may be a DIP socket. The capacitor may be soldered to the connection regions exposed through the receptor opening. Centering bumps may align the capacitor. The plastic may define an exposed area where each of the lead frame regions connects to respective pins, allowing for inspection of the connection between lead frame regions and respective pins.

Claims5

Dependent claims

A socket for connection of a first electrical component to a circuit board comprising

a plurality of pins, each said pin configured for connection of the first component,
a pair of lead frame elements cut from the same lead frame, each said lead frame element having at least one hole through which a said pin extends, each of said pins that extend through a said hole being individually secured to a said lead frame element by soldering or press filting, and each said element including a connection region,
a molded plastic body formed of insulative plastic molded around said lead frame elements and surrounding said pins, said molded body having generally parallel upper and lower surfaces, and said body further having an opening extending from one of said surfaces into the interior of said body sufficiently far to expose said connection regions, and said opening having a size and depth adapted to receive a second component, and
a second electrical component positioned within said opening and soldered to each of said connection regions.

1 more element

Dependencies are inferred from the claim text.