Structure for controlling impedance and cross-talk in a printed circuit substrate
AssigneeDigital Equipment Corporation
InventorScott R. Westbrook
Life of this patent
Estimating the term…
Abstract
An arrangement for interconnecting high density signals of integrated circuits includes an electronic circuit on a multilayered substrate which includes at least three layers. These layers comprise a signal layer for carrying signals in the electronic circuit, a dielectric layer of organic material disposed adjacent the signal layer, and a metallic reference layer. The layers are disposed such that the dielectric layer is between the signal layer and the metallic reference layer. For providing controlled line impedance and for reducing cross-talk between the signals carried in the electronic circuit, the metallic reference layer includes uniformly spaced apertures which are situated in a slanted grid arrangement.
Claims23
A signal carrying arrangement for an electronic circuit, comprising:
- a multilayered substrate having
- a signal layer including signal traces for carrying signals in the electronic circuit,
- a layer of dielectric material disposed adjacent the signal layer, and
- a signal cover layer, disposed such that the dielectric material is between the signal layer and the signal cover layer, including ventilation apertures therein which are spaced so that each of the signal traces traverses approximately an equal number of the apertures to reduce degradation of the signals in the signal traces.
A high density signal carrying arrangement for an electronic circuit, comprising:
- an electronic circuit having leads for carrying signals;
- and
- a multilayered substrate having
- a signal layer including signal traces for carrying signals in the electronic circuit,
- a dielectric layer of organic material disposed adjacent the signal layer, and
- a metallic reference layer, disposed such that the dielectric layer is between the signal layer and the metallic reference layer, including uniformly spaced apertures therein which are situated in a slanted grid arrangement for providing controlled line impedance and for reducing cross-talk between the signals carried in the electronic circuit.
A high density signal carrying arrangement for an electronic circuit, comprising:
- an electronic circuit having leads for carrying signals;
- and
- a multilayered substrate having
- a signal layer including a transmission lines for carrying signals in the electronic circuit,
- a dielectric layer of polyimide material disposed adjacent the signal layer, and
- a metallic reference layer, disposed such that the dielectric layer is between the signal layer and the metallic reference layer, including uniformly spaced apertures therein which are situated in a slanted grid arrangement so that each transmission line traverses approximately an equal number of apertures.
A signal carrying arrangement for an electronic circuit, comprising:
- a multilayered substrate having
- a signal layer including signal traces for carrying signals in the electronic circuit.
- a layer of dielectric material disposed adjacent the signal layer, and
- a signal cover layer, disposed such that the dielectric material is between the signal layer and the signal cover layer, including ventilation apertures situated in a slanted grid arrangement therein, said apertures being spaced so that each of the signal traces traverses approximately an equal number of the apertures to reduce degradation of the signals in the signal traces.
A signal carrying arrangement for an electronic circuit, comprising:
- a multilayered substrate having
- a signal layer including signal traces for carrying signals in the electronic circuit,
- a layer of dielectric material disposed adjacent the signal layer, and
- a signal cover layer, said signal cover layer being a metallic reference plane and being disposed such that the dielectric material is between the signal layer and the signal cover layer, including ventilation apertures situated in a slanted grid arrangement therein, said apertures being spaced so that each of the signal traces traverses approximately an equal number of the apertures to reduce degradation of the signals in the signal traces.
Dependencies are inferred from the claim text.