Semiconductor die packages having lead support frame

A reusable lead pack transport tape and lead pack comprising:

• an elongated tape;
• a plurality of longitudinally uniformly spaced windows formed in said tape;
• a plurality of spaced leads insulated from one another and splayed outwardly from each of said windows and terminating in a test pad;
• a plurality of lead packs carried by said tape, each of said lead packs including lead support frame of insulating material and an array of spaced leads substantially embedded in and carried and supported solely by said frame, each of said leads having one end extending inwardly of said frame to a common area for connection to the bonding pads of an associated semiconductor device and extending outwardly of said frame;
• and
• means for releasably securing the outward ends of said leads to the ends of the transport tape leads at the windows.

A semiconductor device package assembly comprising:

• a lead pack including a lead support frame having upper and lower frame portions of insulating material sealed to one another and an array of spaced leads between said lead frame portions entirely embedded in, surrounded by and supported solely by said frame, each of said leads having one end extending inwardly of said frame to a common area and the other end extending outwardly for connection to an associated circuit;
• a semiconductor device having its bonding pads bonded to the inwardly extending ends of said leads;
• and
• housing means sealed to said lead support frame for housing said semiconductor device.

A semiconductor device package assembly comprising:

• a lead pack including a lead support frame and an array of spaced leads entirely embedded in, surrounded by and supported solely by said frame, each of said leads having one end extending inwardly of said frame to a common area and the other end extending outwardly for connection to an associated circuit;
• a semiconductor device having its bonding pads bonded to the inwardly extending ends of said leads;
• housing means cooperating with said lead support frame for housing said semiconductor device, and
• a bar of insulating material engaging the outer ends of said leads to maintain the same in spaced relationship.

A semiconductor device package assembly comprising:

• a lead pack including a lead support frame and an array of spaced leads entirely embedded in, surrounded by and supported solely by said frame, each of said leads having one end extending inwardly of said frame to a common area and the other end extending outwardly for connection to an associated circuit;
• a semiconductor device having its bonding pads bonded to the inwardly extending ends of said leads;
• housing means cooperating with said lead support frame for housing said semiconductor device,
• a housing enclosing said device and sealed to said frame;
• and
• a bar of insulating material engaging the outer ends of said leads to maintain the same in spaced relationship.