Structurally-embedded electronics assembly

The structurally-embedded electronics assembly adapted for integration with a structure, comprising:

• an outer skin member;
• a primary structural member positioned inboard from said outer skin member, said primary structural member being structured for attachment to the structure;
• a core member positioned between said primary structural member and said outer skin member;
• an antenna structure mounted between said outer skin member and said core member;
• an intermediate skin member positioned between said antenna structure and said core member;
• a thermally conductive baseplate member positioned on the side of the primary structural member which is away from said core member;
• and
• a layer of acoustic damping adhesive operatively positioned between said primary structural member and said thermally conductive baseplate member.

A structurally-embedded electronics assembly for integration with the load-carrying structure of a vehicle, said structurally-embedded electronics assembly comprising:

• an outer skin member;
• a primary load-carrying member positioned inboard from said outer skin member, said primary load-carrying member being structured for attachment to the load-carrying structure;
• a core member positioned between said primary load-carrying member and said outer skin member;
• at least said core member including a predetermined pattern of material having predetermined electromagnetic properties to form a horn antenna to confine and direct electromagnetic energy toward said outer skin member, an antenna feed connected to said horn antenna to introduce said electromagnetic energy into said horn antenna;
• a thermally conductive baseplate member positioned on the side of the primary load-carrying member which is away from said core member;
• and
• a layer of acoustic damping adhesive operatively positioned between said primary load-carrying member and said thermally conductive baseplate member.

A structurally-embedded electronics assembly for integration with the load-carrying structure of a vehicle, said structurally-embedded electronics assembly comprising:

• an outer skin member;
• a primary load-carrying member positioned inboard from said outer skin member, said primary load-carrying member being structured for attachment to the load-carrying structure;
• a core member positioned between said primary load-carrying member and said outer skin member;
• a thermally conductive baseplate member positioned on the side of the primary load-carrying member which is away from said core member;
• a layer of acoustic damping adhesive operatively positioned between said primary load-carrying member and said thermally conductive base plate member;
• and
• an electronic structure positioned between said outer skin member and said core member.

A structurally-embedded electronics assembly for integration with the load-carrying structure of a vehicle, said structurally-embedded electronics assembly comprising:

• an outer skin member;
• a primary load-carrying member positioned inboard from said outer skin member, said primary load-carrying member being structured for attachment to the load-carrying structure;
• a core member positioned between said primary load-carrying member and said outer skin member;
• an intermediate skin member positioned between said outer skin member and said core member;
• an electronics structure positioned between said intermediate skin member and said core member;
• a thermally conductive baseplate member positioned on the side of the primary load-carrying member which is away from said core member;
• and
• a layer of acoustic damping adhesive operatively positioned between said primary load-carrying member and said thermally conductive baseplate member.

A structurally-embedded electronics assembly for integration with the load-carrying structure of a vehicle, said structurally-embedded electronics assembly comprising:

• an outer skin member;
• a primary load-carrying member positioned inboard from said outer skin member, said primary load-carrying member being structured for attachment to the load-carrying structure;
• a core member positioned between said primary load-carrying member an said outer skin member;
• an electronics structure positioned within and enclosed by said core member;
• a thermally conductive baseplate member positioned on the side of the primary load-carrying member which is away from said core member;
• and
• a layer of acoustic damping adhesive operatively positioned between said primary load-carrying member and said thermally conductive baseplate member.