Constant impedance transition between transmission structures of different dimensions
AssigneeHughes Aircraft Company
InventorsCurtis L. Hanz, Jon J. Gulick, Kathleen L. Virga, Allen Podell
Life of this patent
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Abstract
A microstrip transmission line structure a series of connected microstrip strip sections having different widths disposed on an outside layer of a unitized multilayer circuit structure and forming a microstrip line, respective ground planes for each of the strip sections formed between insulating layers of the untilized multilayer circuit structure and respectively spaced from the associated strip sections to provide a substantially constant impedance along the length of the microstrip line, and a plurality of conductive vias for electrically interconnecting the respective ground planes.
Claims7
A microstrip transmission line structure formed in a unitized multilayer circuit structure having a plurality of insulating layers, the microstrip transmission line structure comprising:
- a series of connected microstrip strip sections having different widths disposed on an outside layer of the unitized multilayer circuit structure and forming a microstrip line;
- respective ground planes for each of said strip sections formed between insulating layers and respectively spaced from the associated strip sections to provide a substantially constant impedance along the length of the microstrip line;
- and
- a plurality of conductive vias for electrically interconnecting said respective ground planes.
A microstrip transmission line structure formed in a unitized multilayer circuit structure having a plurality of insulating layers, the microstrip transmission line structure comprising:
- a series of connected microstrip strip sections having different widths disposed on an outside layer of the unitized multilayer circuit structure and forming a microstrip line;
- respective ground planes for each of said strip sections respectively spaced from the associated strip sections to provide a substantially constant impedance along the length of the microstrip line, the lowermost ground plane being formed on the bottom of the unitized multilayer circuit structure and the other ground planes being formed between insulating layers;
- and
- a plurality of conductive vias for electrically interconnecting said respective ground planes.
Dependencies are inferred from the claim text.