Copper/epoxy structures
AssigneesMicroelectronics and Computer Technology Corporation, Minnesota Mining and Manufacturing Company
InventorsDiana C. Duane, Eric L. Zilley, Robert C. Jordan
Life of this patent
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Abstract
A high density, high performance circuit fabricated with a copper/epoxy structure. The circuit is well suited for an integrated circuit interconnect device. Fluorene-containing epoxy resins may be used to obtain certain material and processing advantages over copper/polyimide structures. The circuit structure resides on a substrate which may be ceramic, a semiconductor such as silicon, or, advantageously, a cured epoxy resin.
Claims22
A multilayer circuit comprising:
- a substrate;
- a first cured epoxy resin dielectric layer on said substrate wherein the thermal coefficient of expansion of said first cured epoxy resin dielectric layer and said substrate are matched;
- at least two high density circuit pattern layers located above said first cured epoxy resin dielectric layer wherein said circuit pattern layers exhibit a conductor line density of greater than 300 lines per inch per level;
- and
- a second cured epoxy resin dielectric layer located between said circuit pattern layers.
A high density interconnect device, comprising:
- a substrate;
- a high density interconnect circuit pattern located on said substrate wherein said circuit pattern exhibits a conductor line density of over 300 lines per inch per level;
- and
- a cured epoxy resin dielectric surrounding said circuit pattern wherein said cured epoxy resin has a glass transition temperature of at least 175.degree. C.
A high density interconnect device, comprising:
- a substrate;
- a high density interconnect circuit pattern located on said substrate wherein said circuit pattern exhibits a conductor line density of over 300 lines per inch per level;
- and
- a cured epoxy resin dielectric surrounding said circuit pattern wherein said cured epoxy resin contains a fluorene-containing polyepoxide.
A high density interconnect device, comprising:
- a substrate;
- a high density interconnect circuit pattern located on said substrate wherein said circuit pattern exhibits a conductor line density of over 300 lines per inch per level;
- and
- a cured epoxy resin dielectric surrounding said circuit pattern wherein said cured epoxy resin contains an adjuvant.
A high density interconnect device, comprising:
- a substrate;
- a high density interconnect circuit pattern located on said substrate wherein said circuit pattern exhibits a conductor line density of over 300 lines per inch per level;
- and
- a cured epoxy resin dielectric surrounding said circuit pattern.
Dependencies are inferred from the claim text.