Automatic bonding tape used in semiconductor device
AssigneeShinko Electric Industries Co., Ltd.
InventorsNorio Wada, Katsuya Fukase, Hirofumi Uchida
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Abstract
A TAB tape or tape-like carrier used for an automatic bonding process when manufacturing high-frequency semiconductor devices has a plurality of electrically conductive circuit patterns on a flexible insulative film having a plurality of holes located in gaps between adjacent circuit patterns. A ground layer is formed on a back surface of the insulative film, and electrically conductive layers or material are formed on inner peripherals walls of the holes or filled in the holes, so that the ground layer is electrically connected to the respective condcutive layers or material.
Claims9
A tape for manufacturing high-frequency semiconductor devices, which tape comprises:
- a flexible insulative film;
- a plurality of electrically conductive circuit patterns formed on first areas of a first surface of said insulative film for transmitting high-frequency signals, at least one of said conductive circuit patterns being used as a ground connecting line;
- a plurality of holes formed in second, other areas of the insulative film, each of said holes having an inner peripheral wall;
- a metallic ground layer formed on a second surface of said insulative film opposite to said first surface;
- and
- electrically conductive material formed on the inner peripheral walls of said holes or filled in said holes to prevent crosstalk between said circuit patterns, said ground layer being electrically connected to said respective conductive material and also electrically connected to said ground connecting line.
Dependencies are inferred from the claim text.