Wafer processing films
AssigneeMitsui Toatsu Chemicals, Inc.
InventorsYasuo Takemura, Osamu Narimatsu, Kazuyoshi Komatsu
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Abstract
The present invention relates to a wafer processing film used for the prevention of breakage upon grinding a semiconductor wafer. The wafer processing film has a base film an adhesive layer provided on one surface of the base film and a synthetic resin film arranged on the adhesive layer. The surface roughness of the surface of the synthetic resin film in contact with the adhesive layer is not greater than 2 .mu.m. The present invention provides a wafer processing film which can protect the surface of a wafer from contamination and corrosion after grinding the wafer.
Claims5
A wafer processing film comprising a base film, an adhesive layer provided on one surface of said base film and a polypropylene film arranged on said adhesive, layer,, the surface roughness of the surface of said polypropylene film in contact with said adhesive layer being not greater than 2 .mu.m.
Dependencies are inferred from the claim text.