Polyimide coating having electroless metal plate

A method for forming a coating composed of a polyimide layer having an electroless copper plate tightly bonded thereto, said method comprising

• applying to a substrate a solution composed of a polyamic acid compound dissolved in a vaporizable solvent,
• heating the solution at a temperature less than 250.degree. C. to imidize the compound and vaporize the solvent to form a soft-cured polyimide film containing at least 5 weight percent vehicle,
• immersing an exposed surface of the soft-cured film in an aqueous suspension of palladium-tin colloidal particles to deposit the particles onto the surface,
• treating the deposited particles to dissociate the tin and produce palladium nuclei dispersed on the soft-cured film surface,
• heating the soft-cured film at a temperature greater than about 250.degree. C. to form a hard-cured polyimide layer, whereupon the palladium nuclei are dispersed on the surface of said hard-cured layer, and
• immersing the palladium bearing hard-cured surface in an electroless copper deposition solution containing dissolved ionic copper species and formaldehyde under conditions suitable to cause the palladium nuclei to catalyze reduction of the species to initiate deposition of metallic copper onto the surface, said deposition continuing in the presence of said nascent copper for a time sufficient to form a continuous copper plate tightly bonded to the hard-cured polyimide layer.

A method for forming a copper-clad polyimide coating on a substrate, said method comprising

• applying to the substrate a solution composed of a polyamic acid compound dissolved in a vaporizable organic solvent,
• heating the solution at a temperature between about 175.degree. C. and 225.degree. C. for a time not greater than about 2 hours to form a soft-cured polyimide film,
• immersing the soft-cured film in an aqueous suspension of palladium-tin colloidal particles to deposit the particles onto the film,
• treating the deposited particles to dissociate the tin and produce palladium nuclei dispersed on the soft-cured film,
• heating the soft-cured film at a temperature between about 250.degree. C. and 350.degree. C. for a time not greater than about 2 hours to form a hard-cured polyimide layer, whereupon the palladium nuclei are dispersed on said hard-cured layer,
• electrolessly depositing copper metal onto the palladium-bearing hard-cured layer by immersing the layer in a aqueous alkaline solution containing a dissolved cuprous species and formaldehyde, whereupon the palladium nuclei catalyze reduction of the species by the formaldehyde to initiate deposition, and continuing said deposition in the presence of said nascent copper for a time sufficient to form a continuous copper plate, and
• heating the copper-plated hard-cured polyimide layer above 350.degree. C. to finish curing the polyimide and thereby produce a laminate comprising a fully cured polyimide layer having a continuous copper plate tightly bonded thereto.

A method for forming a copper-clad polyimide layer on a substrate, said method comprising

• applying to the substrate a solution composed of a polyamic acid compound dissolved in a vaporizable vehicle composed predominantly of N-methyl-2-pyrrolidone compound,
• heating the solution at a temperature between about 175.degree. C. and 225.degree. C. for a time not greater than about 2 hours to form a soft-cured polyimide film,
• immersing the soft-cured film in an aqueous suspension of palladium-tin colloidal particles to deposit the particles onto an exposed surface of the film,
• treating the deposited particles to dissociate the tin and produce palladium nuclei dispersed on the soft-cured film,
• heating the soft-cured film at a temperature between about 275.degree. C. and 300.degree. C. for a time not greater than about 2 hours to form a hard-cured polyimide layer, whereupon the palladium nuclei are dispersed on the surface of said hard-cured layer,
• immersing the palladium-bearing surface of said hard-cured coating in a solution containing dissolved copper ions and formaldehyde, whereupon the palladium nuclei are effective to catalyze reduction of the copper in the presence of the formaldehyde to initiate deposition of metallic copper onto the surface, said deposition continuing in the presence of said nascent copper for a time sufficient to form a continuous copper plate, and
• heating the copper-plated hard-cured polyimide layer at a temperature between about 350.degree. C. and 450.degree. C. to final cure the polyimide layer and thereby produce a fully cured polyimide layer having a continuous copper plate tightly bonded thereto.