Low moisture hot rolling process and product
AssigneeHershey Foods Corporation
InventorChron-Si Lai
Life of this patent
Estimating the term…
Abstract
The present invention relates to a low moisture hot rolling process for preparing expanded grain products without the extended time or high energy requirements of prior art processes. More particularly, the present process comprises wetting parboiled grain to a moisture content of between 8-16%; optionally tempering the moistened grain; plasticizing the moistened grain; compressing the moistened grain to reduce kernel thickness; and, toasting the compressed grain to obtain an improved expanded grain product.
Claims25
A low moisture hot rolling process for preparing expanded grain products consisting essentially of:
- a. uniformly wetting parboiled grain to a moisture content of between about 8% to 16%;
- b. plasticizing the moistened grain at a temperature of from 50.degree. C. to 100.degree. C. whereby no sever loss of moisture occurs during heating;
- c. compressing the plasticized grain at a moisture content of 11% to 15% and a temperature of 65.degree. C. to 100.degree. C.;
- and
- d. toasting the compressed grain to obtain an expanded grain product.
A low moisture hot rolling process for preparing expanded grain products consisting essentially of;
- a. wetting the parboiled grain to a moisture content of between about 11% to 15%;
- b. tempering the moistened grain to allow uniform distribution of moisture;
- c. plasticizing the moistened grain to a temperature of from 50.degree. C. to 100.degree. C. by microwave energy whereby no severe loss of moisture occurs during heating;
- d. compressing the plasticized grain at a moisture content of 11% to 15% and a temperature of 65% to 100.degree. C. to reduce kernel thickness;
- e. allowing the compressed grain to stand less than about one hour prior to toasting;
- and
- f. toasting the low moisture grain product.
Dependencies are inferred from the claim text.