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US 5,183,592 AGranted
Electroconductive adhesive comprising an epoxy novolak resin and phenol-aralkyl resin
AssigneeHitachi Chemical Company, Ltd.
InventorsNobuo Ichimura, Yauso Miyamoto, Mitsuo Yamazaki
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Abstract
An electroconductive adhesive comprising an epoxy-novolak resin, a phenol-aralkyl resin, a glycidyl group-containing silane coupling agent, an organic borate and an electro-conductive metal power is excellent in reliability in moisture and hydrolytic resistance and useful for semiconductor devices.
Claims5
An electroconductive adhesive comprising:
- (a) an epoxy-novolak resin,
- (b) a phenol-aralkyl resin,
- (c) a glycidyl group-containing silane-based coupling agent,
- (d) at least one organic tetraphenyl borate, and
- (e) an electroductive metal powder;
- the component (b) being contained in an amount to make the number of phenolic OH groups per one epoxy group of the component (a) in the range of 0.6 to 1.5, the component (c) being contained in an amount of 30 to 500% by weight based upon the weight of component (a), the component (d) being contained in an amount of 1 to 20% by weight based on the weight of component (b), and the component (e) being contained in an amount of 65 to 85% by weight based on the total weight of the components (a), (b), (d) and (e).
3 more elements
Dependencies are inferred from the claim text.