Method of forming a high temperature resistant copper coating on an inorganic dielectric

Abstract

The method of forming a high temperature resistant copper coating on a ceramic and/or enamel substrate, includes the steps of chemically depositing a copper layer having a thickness of at least 3 .mu.m on the substrate, heating the copper layer formed thereon at a temperature of from 200.degree. to 450.degree. C., mechanically treating the copper layer with brush and polishing means to consolidate an upper surface thereof and galvanically depositing an additional copper layer having a thickness of 3 .mu.m on the upper surface. The high temperature resistant copper coating for the ceramic or enamel substrate can stand a higher thermal load for a longer time than similar conventional coatings and can act to rapidly dissipate heat generated by electronic components.

Dependencies are inferred from the claim text.