Process for metallization of a nonconductor surface, especially on a circuit board having preexisting copper surfaces

A process for directly metallizing a nonconductor surface on a circuit board also having copper surfaces, comprising the steps of reacting the nonconductor surface on the circuit board with permanganate to form manganese dioxide adsorbed on the nonconductor surface;

• depositing an adherent, insoluble polymer product the manganese dioxide adsorbed on the nonconductor surface from an aqueous solution of a weak acid having an acid dissociation constant, for loss of a proton in aqueous solution, between 0.1 and 0.01, a monomer selected from the group consisting of pyrrole and pyrrole derivatives, and at least one oligomer selected from the group consisting of oligomers of said pyrrole derivatives and said pyrrole;
• by contacting the aqueous solution with the manganese dioxide adsorbed on the nonconductor surface, the polymer product having an electrical conductance which is sufficient so that a metal can be directly electroplated on the polymer product, and then directly electroplating the metal on the polymer product, wherein any oxide film formed on said copper surfaces during said reacting with said permanganate is removed by said weak acid in said aqueous solution during said contacting to prevent formation of another polymer layer on said copper surfaces.