Reversible production process for assembly of circuit board and substrate
AssigneeSociete Francaise de Detecteurs Infrarouges-Sofradir
InventorJean-Louis Montanari
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Abstract
Production process for the reversible assembly of an electronic read and/or operating circuit board having a front face with conductive tracks and a rear face which is metallized and an electrically conductive or nonconductive support or substrate which may include metallized conductive tracks. The assembly is achieved by use of an electrically insulating silicone adhesive layer. A conductive foil is interposed between the rear face of the circuit board and the adhesive layer and is connected to a terminal in the support.
Claims6
A method of attaching a circuit board to a substrate wherein the front face of the circuit board has conductive tracks thereon and the back face of said circuit board is metalized, the method including the steps of
- placing a silicone adhesive layer between the back face of the circuit board and a substrate,
- interposing a conductive foil between the back face of the circuit board and the adhesive layer, and
- connecting the foil to a terminal mounted upon the substrate.
Dependencies are inferred from the claim text.