Film carrier for RF IC

Abstract

A waveguide film carrier includes an insulating flexible substrate, RF, bias supply and ground electrodes formed on the insulating flexible substrate, and conductive leads connected to the electrodes. An opening portion corresponding to a bare-chip semiconductor element to be mounted is formed in a portion of the insulating flexible substrate. The leads are formed to project in the opening portion at positions corresponding to electrode pads of the bare-chip semiconductor element to be mounted. The leads are formed on an outer peripheral portion of the insulating substrate to project at positions corresponding to the internal connection terminals of the package. The waveguide film carrier further includes at least one waveguide. The waveguide is constituted by the RF electrodes for contributing to RF signal propagation, the ground electrodes and the insulating flexible substrate.

Dependencies are inferred from the claim text.