Thermal head
AssigneeAlps Electric Co., Ltd.
InventorsMasakazu Kato, Takatoshi Ishikawa, Tetsuo Ishikawa
Life of this patent
Estimating the term…
Abstract
A thermal head for a thermal-transfer or heat-sensitive printer has a silicon substrate having a projection. A porous silicon layer having a small thermal conductivity is formed on the silicon substrate so as to cover at least the projection on the silicon substrate. A heat-generating resistor layer is formed on the porous silicon oxide layer in a region above the projection of the silicon substrate. A conductor layer is formed on the heat-generating layer so as to expose the portion of the heat-generating resistor layer which is right above the projection of the silicon substrate and which serves as a heat-generating portion. The heat-generating portion and the conductor layer are covered by a protective layer.
Claims9
A thermal head comprising:
- a silicon substrate having a projection defining a peripheral portion and a centrally-located crest;
- a porous silicon oxide layer formed on said projection;
- a heat-generating resistor layer formed on said porous silicon oxide layer;
- a conductor layer formed on said heat-generating resistor layer, said conductor layer defining an opening disposed adjacent said crest;
- and
- a protective layer formed to cover said heat-generating
A thermal head comprising:
- a silicon substrate having a projection comprising a peripheral region having a first surface defining a first slope, a crest region centrally located within said peripheral region having a second surface defining a second slope and a peak region, said second slope being greater than said first slope, and a porous silicon oxide region formed in said central crest region;
- a heat-generating resistor layer formed on said second surface;
- and
- a conductor layer formed on said heat-generating resistor layer over said second slope and defining an opening such that said peak region is exposed.
Dependencies are inferred from the claim text.