Molding materials
AssigneesNippon Steel Chemical Co., Ltd., Nippon Steel Corporation
InventorsToshihiro Yamamoto, Masao Kimura, Keiichi Saito
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Abstract
Molding materials of this invention comprise copolymers consisting essentially of 10 to 30% by weight of .alpha.-methylstryene units. 40 to 70% by weight of methyl methacrylate and 10 to 30% by weight of stryene units with a weight average molecular weight in the range from 50,000 to 200,000, a melt flow rate (MFR) in the range from 4 to 18 g./10 min. at 220.degree. C. under a 10-kg load, and a Vicat softening point of 130.degree. C. or more, show a high degree of transparency, good heat and weather resistance and good moldability and are best suited for such uses as automotive and electrical parts.
Claims1
Molding materials comprising copolymers consisting essentially of 10 to 30% by weight of .alpha.-methylstyrene units, 40 to 70% by weight of methyl methacrylate units and 10 to 30% by weight of styrene units with a weight average molecular weight in the range from 50,000 to 200,000, a melt flow rate (MFR) in the range from 4 to 18 g./10 min. at 220.degree. C. under a 10-kg load and a Vicat softening point of 130.degree. C. or more.
Dependencies are inferred from the claim text.