Plating solution automatic control
AssigneeC. Uyemura & Co., Ltd.
InventorsShigeo Hashimoto, Yutaka Sugiura
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AssigneeC. Uyemura & Co., Ltd.
InventorsShigeo Hashimoto, Yutaka Sugiura
Estimating the term…
The concentration of a plating solution in which a workpiece is plated is automatically controlled within a permissible range of replenishing a consumable ingredient to the plating solution in an amount corresponding to the amount of consumption estimated from the surface area of the workpiece for a given plating solution composition under given plating conditions. By measuring the concentration of the consumable ingredient in the plating solution, the replenishment of consumable ingredient is interrupted for a predetermined time or the amount of the consumable ingredient replenished is reduced when the measured concentration is above the permissible range, or the amount of consumable ingredient replenished is increased or a necessary amount of the consumable ingredient is additionally supplied to the plating solution separately from the normal replenishment of consumable ingredient when the measured concentration is below the permissible range.
An apparatus for automatically and continuously controlling a concentration of an electroless plating solution comprising:
Dependencies are inferred from the claim text.