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AssigneesHitachi, Ltd., Hitachi Techno Engineering Co., Ltd.
InventorsAkimi Miyashita, Mutsumasa Fujii, Minoru Kubosawa, Keiichiro Torii, Nobuaki Ooki, Kiyonori Kogawa, Masami Kawaguchi, Hideyasu Murooka, Masayuki Kyooi
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A hot press including a displaceable sleeve for surrounding materials of a multi-layer substrate under a reduced pressure condition, a gas pressurizing condition and a heating condition with thermal plates. Upper and lower sealing units seal an interior of the sleeve, with a mechanism lowering and raising the sleeve. A pilot check mechanism prevents a lower bolster from raising/lowering upon the reduced pressure condition and the gas pressure condition, and a retainer maintains the lowered or raised condition of the sleeve. The multi-layer substrate is formed under the reduced pressure condition and the gas pressure condition. Accordingly, the atmosphere and moisture between the materials of the multi-layer substrate and volatile composition are removed. Additionally, a void generated during the heat and pressure process by the heating plates is eliminated from the multi-layer substrate. By carrying out the formation of the multi-layer substrate at the heat and pressure by the heating plates under the gas pressure condition, a final dimensional precision and shape are enhanced and a warpage or twist is suppressed.
A hot press for mutually aligning materials of a multi-layer substrate of printed circuit boards and adhesive resin and interposing the materials into the heating plates and effecting heating and pressurization to form the multi-layer substrate, the hot press comprising:
A hot press for mutually aligning materials of a multi-layer substrate of printed circuit boards and adhesive resin and interposing the materials into heating plates and effecting heating and pressurization to form the multi-layer substrate, the hot press comprising:
Dependencies are inferred from the claim text.