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US 5,181,770 AGranted
Surface topography optimization through control of chloride concentration in electroformed copper foil
AssigneeOlin Corporation
InventorsAndrew J. Brock, Lifun Lin, Paul Menkin, Ned W. Polan
Life of this patent
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Abstract
An electrolyte solution for the electroforming of metal foil, such as copper, is provided. The electrolyte contains an effective concentration of chloride ions to promote the formation of a uniformly matte surface finish. Foil so formed forms a strong mechanical bond with a dielectric substrate during a subsequent lamination process.
Claims9
A process for forming an electroformed metal foil having a uniform matte surface texture, comprising the steps of:
- providing an electrodeposition system containing:
- (a) a tank containing an electrolyte solution;
- (b) providing an essentially contamination-free acidic electrolyte in which impurities such as organics and sulfides are less than about 5 parts per million and containing ions of copper and an effective concentration of chloride ions to produce said uniform matte surface texture, said electrolyte comprising from about 50 grams per liter to about 150 grams per liter copper, from about 10 grams per liter to about 100 grams per liter sulfuric acid and from about 0.5 ppm to about 2.5 ppm chloride;
- (c) a cathode having a continuous plating surface at least partially immersed in said electrolyte solution, said immersed plating surface defining the extent of the plating zone;
- and
- (d) an anode;
- applying a desired current density to said cathode and said anode for plating metal values from said electrolyte solution onto said plating surface to generate a substantially uniform current distribution throughout said plating zone for promoting formation of said substantially uniform metal foil thereby electrolytically generating said foil of copper from said electrolyte;
- filtering said electrolyte so that it is essentially free of sulfides, organic materials and other contaminants and particulates;
- and
- providing a flow rate of said electrolyte past said cathode sufficient to prevent oxygen accumulation along said cathode.
7 more elements
A process for forming an electroformed metal foil having a uniform matte surface texture, comprising the steps of:
- providing an electrodeposition system containing:
- (a) a tank containing an electrolyte solution;
- (b) providing an essentially contamination-free acidic electrolyte in which impurities such as organics and sulfides are less than about 5 parts per million and containing ions of copper and an effective concentration of chloride ions to produce said uniform matte surface texture, said electrolyte comprising from about 50 grams per liter to about 150 grams per liter copper, from about 10 grams per liter to about 100 grams per liter sulfuric acid and from about 10 ppm to about 50 ppm chloride;
- (c) a cathode having a continuous plating surface at least partially immersed in said electrolyte solution, said immersed plating surface defining the extent of the plating zone;
- and
- (d) an anode;
- applying a desired current density to said cathode and said anode for plating metal values from said electrolyte solution onto said plating surface to generate a substantially uniform current distribution throughout said plating zone for promoting formation of said substantially uniform metal foil thereby electrolytically generating said foil of copper from said electrolyte;
- filtering said electrolyte so that it is essentially free of sulfides, organic materials and other contaminants and particulates;
- and
- providing a flow rate of said electrolyte past said cathode sufficient to prevent oxygen accumulation along said cathode.
7 more elements
Dependencies are inferred from the claim text.