Method and apparatus for vapor phase soldering and cleaning products
OwnerHelmut W. Leichtinventor
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Abstract
The described cleaning of work pieces, in particular printed circuit boards or assemblies, after the soldering, is performed by washing with an inert cleansing fluid which is maintained at a temperature slightly below the melting point of the solder. As a result, solvents for dissolving the impurities and soldering fluxes which are harmful to the environment can be dispensed with. This cleaning is particularly advantageous subsequent to the vapor phase soldering since the same fluid can be used for the cleansing fluid as for the heat transfer medium in the vapor phase soldering apparatus. Therefore, the problem of an unwanted mixing of different treatment media (on the one hand heat transfer medium and on the other hand cleansing fluid) does not arise.
Claims29
In a method for vapor phase soldering and removing solder residues from products after the soldering process, in particular from printed-board assemblies or circuit modules, the improvement comprising removing solder residues from the products by washing the products with an inert cleansing fluid which is maintained as a liquid at a temperature below the melting point of the solder, and that the fluid used as cleansing fluid is the same as the one used as a heat transfer medium during the vapor phase soldering.
An apparatus for vapor phase soldering and for removing solder residues from products after the soldering process in a treatment station (201), characterized by a cleaning station (101) comprising several nozzle devices (106) directed to the products to be cleaned for spraying heat transfer medium as inert cleansing fluid and by a means for adjusting the temperature of the cleansing fluid at a value below the boiling point of the inert cleansing fluid and below the melting point of the solder.
Dependencies are inferred from the claim text.