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AssigneeFujitsu Limited
InventorsMikio Nishihara, Teruo Murase, Kiyotaka Seyama, Kiyoshi Kuwabara, Osamu Ohshima
Estimating the term…
A method of making an engineering change to a printed wiring board changes connection for a terminal of an electronic component which is mounted on the printed wiring board through a terminal pad. The terminal is electrically connected to a destination through the terminal pad and wiring within the printed wiring board. The present invention places an insulator, including an insulating material and a conductive layer formed thereon, between the terminal and the terminal pad. The electronic component is mounted on the printed wiring board and the terminal is electrically connected to the conductive layer. A discrete wire is placed between the conductive layer and the destination.
A method of making an engineering change to a printed wiring board to change a connection for a terminal of an electronic component, which is mounted on the printed wiring board, through a terminal pad, the terminal being electrically connected to a destination through the terminal pad and wiring within the printed wiring board, said method of making the engineering change comprising the steps of:
Dependencies are inferred from the claim text.