Solid state image sensor having high charge transfer efficiency
AssigneeNEC Corporation
InventorHisao Kawaura
Life of this patent
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AssigneeNEC Corporation
InventorHisao Kawaura
Estimating the term…
A solid state image sensor comprises a p-type semiconductor region, an n-type photoelectric conversion region formed in a surface region of the semiconductor region, an n-type charge transfer region formed in the surface of the semiconductor region separately from the photoelectric conversion region, and an electric charge read-out gate region formed between the photoelectric conversion region and the charge transfer region. A p.sup.+ thin surface layer region if formed to cover a surface of the photoelectric conversion region excluding an end portion adjacent to the electric charge read-out gate region. A gate electrode is formed above the electric charge read-out gate region. The end portion of the photoelectric conversion region not covered by the thin surface layer region, has a short length sufficient to make a potential well formed in the portion shallow under influence of potentials of the p.sup.+ thin surface layer region and the electric charge read-out gate region. Preferably, this end portion of the photoelectric conversion region is formed of a surface region having a low impurity concentration.
A solid state image sensor comprising a semiconductor region of a first conduction type, a photoelectric conversion region of a second conduction type formed in a surface region of said semiconductor region, a charge transfer region of the second conduction type formed in the surface region of said semiconductor region and separated from said photoelectric conversion region, an electric charge read-out gate region formed between said photoelectric conversion region and said charge transfer region, a thin surface layer region of the first conduction type having a high impurity concentration and formed to cover a surface of said photoelectric conversion region excluding an end portion adjacent to said electric charge read-out gate region, and a gate electrode formed above said electric charge read-out gate region and extending to partially overlap said photoelectric conversion region, said gate electrode being electrically isolated from said electric charge read-out gate region and said photoelectric conversion region, said end portion of said photoelectric conversion region which is adjacent to said electric charge read-out gate region and which is not covered by said high concentration thin surface layer region, having a short length sufficient to make a potential well formed in said end portion shallow under influence of potentials of said high concentration thin surface layer region and said electric charge read-out gate region;
A solid state image sensor comprising a semiconductor region of a first conduction type, a photoelectric conversion region of a second conduction type formed in a surface region of said semiconductor region, a charge transfer region of the second conduction type formed in the surface region of said semiconductor region and separated from said photoelectric conversion region, an electric charge read-out gate region formed between said photoelectric conversion region and said charge transfer region, a gate electrode formed above said electric charge read-out gate region and extending to partially overlap said photoelectric conversion region, said gate electrode being electrically isolated from said electric charge read-out gate region and said photoelectric conversion region, and a thin surface layer region of the first conduction type having a high impurity concentration and formed to cover a surface of said photoelectric conversion region not covered under said gate electrode, said high concentration thin surface layer region extending onto a portion of said photoelectric conversion region which is positioned directly under said gate electrode, and terminating without contact with said electric charge read-out gate region so that said photoelectric conversion region has an end portion which is adjacent to said electric charge read-out gate region and which is not covered by said high concentration thin surface layer region, said end portion having a short length sufficient to ensure that a potential well formed by a voltage applied to said gate electrode becomes shallow because of a short channel effect between said high concentration surface layer region and said electric charge read-out gate region, and said end portion being formed of a low impurity concentration surface region;
Dependencies are inferred from the claim text.