High voltage CMOS devices
AssigneeSeiko Epson Corporation
InventorYutaka Maruo
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AssigneeSeiko Epson Corporation
InventorYutaka Maruo
Estimating the term…
A semiconductor memory and method of manufacture which are particularly useful for a high breakdown voltage EEPROM wherein high breakdown voltage transistors which are employed in a relatively large number and therefore greatly affect the integration density are formed with the masked offset structure, which is advantageous from the viewpoint of the integration density, while high breakdown voltage transistors which are not required in a large number and therefore have no large effect on the integration density are formed with the LOCOS offset structure, which requires a relatively small number of manufacturing steps and hence involves a relatively low production cost, and these two different types of transistors are fabricated on the same substrate. This arrangement enables optimization of the device structure in regard to miniaturization, reduction in the number or masks required and simplification of the manufacturing process.
In a semiconductor device comprising a substrate having a memory cell region and a peripheral circuit region, the memory cell region being composed of a plurality of memory transistors each defined by a first high breakdown voltage transistor of a first conductivity type and a plurality of select transistors each defined by a second high breakdown voltage transistor of the first conductivity type, and the peripheral circuit region having a part which is constituted by a third high breakdown voltage transistor of a second conductivity type, the improvement wherein:
In a complementary semiconductor device comprising a substrate having a plurality of high breakdown voltage transistors of a first conductivity type and at least one high breakdown voltage transistor of a second conductivity type opposite to the first conductivity type, the improvement wherein:
Dependencies are inferred from the claim text.