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US 5,180,801 AGranted
Heat curable epoxy compositions
AssigneeGeneral Electric Company
InventorsJeffrey H. Wengrovius, Virginia M. Van Valkenburgh
Life of this patent
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Abstract
A polysilanesiloxane such as a cyclic dimer of disilanesiloxane has been found to be useful in promoting the thermal cure of epoxides such as silicone epoxides. Enhancement in the rate of thermal cure of the epoxy compositions containing such polysilanesiloxanes can be effected with an effective amount of a platinum catalyst.
Claims8
A heat curable epoxy composition comprising by weight,
- (A) 100 parts of an epoxy resin, and
- (B) 0.1 to 25 parts of a polysilanesiloxane comprising chemically combined polysilyloxy groups.
A heat curable epoxy composition comprising by weight,
- (A) 100 parts of an epoxy resin, and
- (B) 0.1 to 25 parts of a polysilanesiloxane having chemically combined tetraorganodisilyloxy groups of the formula, ##STR5## where R can be the same or different and is a member selected from the class consisting of monovalent C.sub.(1-14) hydrocarbon radicals and C.sub.(1-14) hydrocarbon radicals substituted with monovalent radicals inert during equilibration.
Dependencies are inferred from the claim text.