Polymer composition for foam molding
AssigneeMitsubishi Cable Industries, Ltd.
InventorsYukio Morita, Toshihiro Zushi, Nobuyoshi Matsuda, Kaneharu Suga, Takuma Takai
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Abstract
Polymer compositions for molding in the presence of a foaming agent which comprise at least a polyolefin resin as a base resin and low polarity boron compound powder which is not decomposed at a foaming temperature, such as boron nitride powder as a nucleator. Polymer compositions of the invention are useful for formation of a foamed insulating layer on a conductive material by way of foam molding. By using said polymer composition, a foamed insulating layer excellent in insulation properties which has small dielectric loss factor, tan .delta., at high frequency and high extent of foaming of not less than 70% can be obtained.
Claims20
A foamable electrical insulator composition consisting essentially at least a propylene-ethylene copolymer containing 0.5-20 weight % ethylene component as a base resin, a foaming agent and a low polarity boron compound powder which is not decomposed at a foaming temperature as a nucleator.
An insulator for a coaxial cable prepared from a composition consisting essentially of propylene-ethylene copolymer as a base resin, a foaming agent and a nucleator of low polarity boron compound powder which does not decompose at a foaming temperature.
Dependencies are inferred from the claim text.