Method for the production of a semiconductor laser device

Abstract

There is provided a method for the production of a semiconductor laser device which emits laser light from an end facet thereof. This method comprises the steps of: forming a multi-layered structure including an active layer for laser oscillation on a semiconductor substrate; etching the semiconductor substrate and the multi-layered structure to form a pluralilty of striped grooves parallel to each other in such a manner that a plurality of projections are formed on the side face of the multi-layered structure in the striped grooves; separating the projections from the multi-layered structure to form a pair of cleavage planes each functioning as a resonator facet; forming a large-band-gap layer on at least one of the cleavage planes on the light-emitting side, the large-band-gap layer having a larger band gap than that of the active layer; forming a reflecting film on the large-band-gap layer; and finally cleaving the semiconductor substrate and the multi-layered structure to obtain a plurality of semiconductor laser devices.

Dependencies are inferred from the claim text.