Metal mold for resin substrate for an optical recording medium

A metal mold for fabricating a resin substrate for an optical recording medium having a light incident surface and a signal pattern surface comprising:

• a stamper on which a reverse pattern of a signal pattern which is to be transferred onto said resin substrate is formed,
• a backing plate for reinforcing said stamper,
• a stamper inner circumference presser for fixing an inner circumference of said stamper to said backing plate,
• a stamper outer circumference presser having a first free end and a second stepped clamping end for loosely restricting an outer circumference of said stamper;
• and
• a mirror plate having an outer peripheral stepped portion for engaging said first free end of said stamper outer circumference presser,
• said second stepped clamping end of said outer circumference presser having a medial portion for providing a clearance between said stamper and said outer circumference presser and a lateral portion which engages a stepped portion of said backing plate, said medial portion having a side surface a portion of which engages said outer peripheral stepped portion of said mirror plate and a portion of which forms a cavity side surface, whereby as a result of constructing said metal mold a cavity is defined between said mirror plate, said stamper and said cavity side surface of said medial portion of said outer circumference presser, said cavity side surface of said medial portion of said outer circumference presser having a circumferential lower edge which extends into said cavity, a distance between said side surface portion juxtapositioned said outer peripheral stepped portion of said mirror plate being greater than a distance between said side surface portion which forms said cavity side surface,
• said clearance between said stamper and said outer circumference presser having a dimension such that upon fabrication of said resin substrate a burr is permitted to form around a circumference of said signal pattern surface of said substrate in conformity with said clearance, an external dimension of said burr extending radially from said signal pattern surface of said resin substrate being smaller than an external dimension of said light incident surface so that said burr never projects outside a circumference of said light incident surface of said substrate.