US 5,180,571 A · Process for the preparation of diamond

Abstract

An interrupting layer of inorganic powder other than diamond is formed on the surface of a substrate and a surface of the interrupting layer is contacted with excited raw material gases containing a carbon source, under conditions suited to depositing of diamond on the interrupting layer. The diamond which is synthesized is separated from the substrate. The use of the interrupting layer, composed of the inorganic fine powders, allows ready separation of the diamond from the substrate and the diamond separated is suitable for diaphragms for speakers, heat conductive plates, cutting tools, semiconductors, etc. by appropriately choosing shapes of the substrate. Further, the resulting diamond film can be pulverized, thereby yielding diamond powders which are useful for abrasive tools, cutting tools, etc.

Claims11

Dependent claims

A process for preparing diamond by vapor phase synthesis comprising:

forming an interrupting layer of inorganic powders comprising at least one member selected from the group consisting of SiC, Si, Mo, W, Al.sub.2 O.sub.3, Ti, Ta, TiO.sub.2, h-BN, c-BN, SiO.sub.2, B.sub.4 C, AlN, Si.sub.3 N.sub.4, WC, MoC, graphite, and MoS.sub.2, which have an average particle size of 0.01 to 10 .mu.m, on a surface of a substrate, said interrupting layer having a thickness of 0.1 microns or more so that the entire surface of said substrate is substantially uniformly covered;
depositing diamond on the surface of the interrupting layer with excited raw material gases contacting carbon source gases;
and
separating the diamond from the interrupting layer.

1 more element

Dependencies are inferred from the claim text.

Process for the preparation of diamond

Life of this patent

Process for the preparation of diamond

Life of this patent

Abstract

Claims11