Method of mounting an electronic part onto a printed circuit board
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorYoshio Zenshi
Life of this patent
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Abstract
In a method of mounting an electronic component onto a printed circuit board by reflow mounting, the electronic component having a plurality of connection leads protruding from the component, a plurality of strips of solder are applied on a group of pads arranged in a line on the printed circuit board. The pads are disposed on the circuit in correspondence to the connection leads, and the connection leads of the electronic component are bonded to the corresponding pads by reflow soldering. By applying solder in strips, their widths need not be excessive, thereby avoiding solder bridging.
Claims15
A method of mounting an electronic component, by reflow soldering, onto a printed circuit board, the electronic component having a plurality of connection leads protruding therefrom, the method comprising the steps of:
- applying a plurality of strips of solder on a group of pads arranged in a line on the printed circuit board, the group of pads being disposed in a one to one correspondence with the connection leads, each of the plurality of strips of solder traversing the group of pads;
- and
- bonding the connection leads of the electronic component to corresponding pads of the group of pads, by reflow soldering, to the plurality of strips of solder.
A method of mounting an electronic component, by reflow soldering, onto a printed circuit board, the electronic component having a plurality of connection leads protruding therefrom, the method comprising the steps of:
- applying a plurality of strips of solder on a group of pads arranged in a line on the printed circuit board, the group of pads being disposed in a one to one correspondence with the connection leads and comprising subgroups of pads, each of the subgroups of pads being traversed by at least two of the plurality of strips of solder;
- and
- bonding the connection leads of the electronic component to corresponding pads of the group of pads, by reflow soldering, to the plurality of strips of solder,
- said step of applying a plurality of strips of solder preventing solder bridging due to insufficient agglomeration of solder on the pads.
A method of mounting an electronic component, by reflow soldering, onto a printed circuit board, the electronic component having four sides and a plurality of connection leads protruding from each of the for sides, the method comprising the steps of:
- applying a plurality of strips of solder on groups of pads arranged in lines on the printed circuit board, pads of the groups of pads being disposed in a one to one correspondence with the connection leads, each of the groups of pads being traversed by at least two of the plurality of strips of solder;
- and
- bonding the connection leads of the electronic component to corresponding pads of the groups of pads, by reflow soldering, to the plurality of strips of solder,
- said step of applying a plurality of strips of solder preventing solder bridging due to insufficient agglomeration of solder on the pads.
Dependencies are inferred from the claim text.