Back to results
US 5,180,094 AGranted
Wire bonder with bonding arm angle sensor
AssigneeKaijo Corporation
InventorsKatsuro Yanagida, Yoshikatsu Hayashizaki
Life of this patent
Estimating the term…
Abstract
A wire bonder processes an angle sensor which detects, without making contact, the angle of rotation of a bonding arm provided so as to be allowed to freely oscillate centered on a shaft supported by a head base, and is able to easily determine the amount of movement of a bonding tool and a distance to a bonding stage.
Claims10
A wire bonder, comprising:
- a head base provided on a member capable of planar movement in at least the X and Y directions;
- a shaft supported by said head base;
- a bonding arm provided so as to be allowed to freely oscillate about said shaft while supporting a bonding tool through which a wire is passed;
- and an angle sensor provided on said wire bonder which detects, without making contact with any moving element, the angle of rotation of said bonding arm as it pivots about said shaft.
1 more element
A wire bonder, comprising:
- a head base provided on a member capable of planar movement in at least the X and Y directions;
- a shaft supported by said head base;
- a bonding arm provided so as to be allowed to freely oscillate about said shaft while supporting a bonding tool through which a wire is passed, said shaft supporting said bonding arm;
- and
- an angle sensor provided on said wire bonder which detects, without making contact with any moving element, the angle of rotation of said bonding arm as it pivots about said shaft, said angle sensor comprising a magnetic angle sensor magnetic body mounted on said shaft and a magnetic angle sensor detector mounted fixedly on said head base.
2 more elements
A wire bonder, comprising:
- a head base provided on a member capable of planar movement in at least the X and Y directions;
- a shaft supported by said head base;
- a bonding arm provides so as to be allowed to freely oscillate about said shaft while supporting a bonding tool through which a wire is passed, said shaft supporting said bonding arm;
- and
- an angle sensor provided on said wire bonder which detects, without making contact with any moving element, the angle of rotation of said bonding arm as it pivots about said shaft, said angle sensor comprising a magnetic angle sensor magnetic body mounted on said shaft and a magnetic angle sensor detector mounted fixedly on said head base,
- wherein the angle of rotation of said bonding arm is determined based upon an output of said angle sensor.
3 more elements
Dependencies are inferred from the claim text.