US 5,180,093 AGranted

Apparatus for ultrasonic bonding

AssigneeCray Research, Inc.

InventorsRandall R. Stansbury, Michael R. Seitz

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Abstract

An ultrasonic transducer, bonding tool and method of bonding gold or gold plated leads to gold or gold plated bonding pads located on unheated substrates is disclosed. More particularly, the transducer of the present invention incorporates a modified transducer/tool interface which provides for increased durability as well as increased excursion control of any bonding tool placed therein. The bonding tool of the present invention includes a modified end having a raised pattern used to form an impression in the lead to be bonded to enhance gripping of the lead during bonding. The preferred methods include using the modified transducer and bonding tool to perform gold-to-gold bonding on unheated substrates while providing increased vertical clearance for bonding between structures.

Claims5

Dependent claims

An ultrasonic transducer device adapted to hold an ultrasonic bonding tool having a substantially circular cross-section, the device comprising:

a first end adapted to cooperate with the bonding tool;
a bonding tool passage formed in the transducer proximate said first end,s aid bonding tool passage adapted to receive the bonding tool in an orthogonal relationship relative to a longitudinal axis of siad device, said bonding tool passage having at least two substnatially flat surfaces which intersect each other opposite said first end;
and
at least one retaining passage formed in said first end, each retaining passage intersecting aid bondign tool passage and extending through said flat surfaces forming a four-point contact area in said flat surfaces, each retaining passage further adapted to receive retaining means for retaining the bonding tool within said bonding tool passage.

1 more element

Dependencies are inferred from the claim text.