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US 5,179,779 AGranted
Method of forming flat multicore wire
AssigneeSumitomo Wiring Systems, Ltd.
InventorsKazuo Iura, Yoshiaki Yamano, Kazuhito Saka
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AssigneeSumitomo Wiring Systems, Ltd.
InventorsKazuo Iura, Yoshiaki Yamano, Kazuhito Saka
Estimating the term…
The present invention improves the quality and productivity in a coating peeling-off process in which the coating at an intermediate portion along the length of a wire is peeled off in order to expose a conductor inside the coated wire, while enabling coatings at intermediate portions along the length of multicore wires or small-diameter wires to be peeled off. In a primary process, a heating jig 16 is brought into press contact with the upper half portion of the coating of the peeling-off designated portion at an intermediate portion along the length of coated wires 1 so as to press down the coating downwardly relative to the transverse direction of the wires, whereby a coating peeled-off portion 20 in which a part of conductors 2 is exposed is formed. Afterwards, in a secondary process, the coating of the coating peeled-off portion 20 is cut and press held at the ends thereof by cutting and peeling-off blades 13 adapted to operate from the ends of the coating peeled-off portion 2 toward the center thereof so as to remove the coating of the coating peeled-off portion 20, whereby a coating peeled-off portion 131 is formed.
A method of forming a flat multicore wire comprising the steps of applying pieces of common coating connecting tape of a slightly short length of the top and bottom surfaces of the coatings at the end portion of a group of round wires, dividing the coatings integrally with said pieces of coating connecting tape that are applied thereon into front and rear half portions, sliding said front half portion forward so as to expose conductors between said front and rear half portions, applying a piece of common conductor connecting tape on the underside of said exposed conductors separately from said piece of coating connecting tape on said rear half portion, and cutting and removing said front half portion so as to allow said exposed conductors to function as a contact portion.
A method of sequentially continuously forming a flat multicore wire having at the ends thereof contact portions each comprising a group of parallel exposed conductors, said method comprising the steps of feeding forward a group of coated wires that are disposed in parallel in a plate-like fashion at predetermined intervals to an intermediate coating peeling-off section, peeling off the coatings of an intermediate peeling-off designated portion of said group of wires so as to form an intermediate coating peeled-off portion, feeding forward said group of wires so peeled off to a connecting tape applying section, applying a piece of common connecting tape to the underside of a group of exposed conductors at said intermediate coating peeled-off portion or the underside of said group of exposed conductors and the coated portion, feeding forward said group of wires so processed to a cutting section, cutting said group of wires at an intermediate position along the length of said intermediate coating peeled-off portion, and constructing said intermediate coating peeling-off process, connecting tape applying process and cutting process such that said group of wires can be continuously processed while being fed forward.
Dependencies are inferred from the claim text.