Method of making multilayer printed wiring boards

Abstract

A method of making a multilayer printed wiring board is provided in which a filler material to be used for filling a clearance/clearances of a patterned conductive layer formed on an internal plate therewith is prepared, then, the filler material thus prepared is disposed between the internal plate and a prepreg sheet so as to correspond respectively to the clearance/clearances, and the internal plate and an external plate are laminted via the prepreg sheet and filler material thus disposed thereby to be adhered integrally to each other. The filler material is preferable to be filmily adhesively provided on one surface of the prepreg sheet by a screen printing method. As the material for this purpose, it is preferable to use a material which behaves similarly to the prepreg sheet and further preferable to use the same material as that of the prepreg sheet.

Dependencies are inferred from the claim text.