Method of manufacturing circuit structure by insert molding of electric and/or optical transmission medium
AssigneeHitachi, Ltd.
InventorsMasao Gotoh, Makoto Iida, Kenichi Waragai, Yonezo Yanokura, Masaki Sato
Life of this patent
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Abstract
A method of manufacturing a circuit structure where the electric and/or optical transmission medium or media include at least one of an optical signal transmission medium, an electric signal transmission medium, and an electric power transmission medium. The transmission media are insert-molded in plastics which is a housing for electronic and electric devices and parts. The circuit structure serves both for conductive circuits and housing so that the electronic and electric devices and parts can be wired and mounted at high density.
Claims7
A method of manufacturing a circuit structure comprising the steps of:
- disposing a transmission medium of a two or three-dimensional shape having at least one type of media in a mold;
- molding said transmission medium employing a first polymer at a low pressure to thereby fix or insulation-cover said transmission medium;
- and
- molding said fixed or insulation-covered transmission medium employing a second polymer at a high pressure under a broadened cavity to thereby obtain a structure uniting said transmission medium.
A method of manufacturing a circuit structure comprising the steps of:
- disposing a transmission medium of a two or three-dimensional shape having at least one type of media in a mold;
- molding said transmission medium employing a first polymer at a low pressure to thereby fix or insulation-cover said transmission medium;
- and
- molding said fixed or insulation-covered transmission medium employing a second polymer at a high pressure under a broadened cavity to thereby obtain a structure uniting said transmission medium;
- wherein said first polymer is a thermosetting resin selected from the group consisting of single substances and filler composites of epoxy resin, phenol resin, and diallyl phthalate resin;
- and
- wherein said second polymer is a thermoplastic resin having heat deflection temperature of more an 200.degree. C. and selected from the group consisting of polyphenylene sulfide (PPS), polyether sulfone (PES), polyetherimide (PEI), polysulfone (PSF), polyethylene terephthalate (PET), polyether etherketone (PEEK), and all-aromatic polyester.
A method of manufacturing a circuit structure comprising the steps of:
- disposing a transmission medium of a two or three-dimensional shape having at least one type of media in a mold;
- molding said transmission medium employing a first polymer at a low pressure to thereby fix or insulation-cover said transmission medium;
- and
- molding said fixed or insulation-covered transmission medium employing a second polymer at a high pressure under a broadened cavity to thereby obtain a structure uniting said transmission medium;
- wherein said molding at a low pressure is a transfer molding conducted at a pressure of 3 to 9 MPa;
- and
- wherein said molding at a high pressure is an injection molding conducted at a pressure of 0.8 to 50 times that of said molding at low pressure.
Dependencies are inferred from the claim text.